Book Online or Call 1-855-SAUSALITO

Sign In  |  Register  |  About Sausalito  |  Contact Us

Sausalito, CA
September 01, 2020 1:41pm
7-Day Forecast | Traffic
  • Search Hotels in Sausalito

  • CHECK-IN:
  • CHECK-OUT:
  • ROOMS:

How Does Fonon BlackStar Maximize Wafer Dicing Yield?

Fonon Corporation’s laser-powered BlackStar Wafer Dicing System helps semiconductor fabricators eliminate defects, distortions, cracks and chipping during wafer dicing. Powered by Fonon’s patented Fantom Width Laser Dicing (FWLD) technology, the innovative next-generation equipment effectively splits brittle materials with no material waste. The result: a higher die yield per wafer, with lower production time and costs involved.

The FWLD allows operators to achieve precise molecular-level splitting of the material with minimal kerf width. The BlackStar’s automated single-step processing improves the quality of the cut edges – one of the critical criteria for fracture resistance. Increased die strength during integrated circuit packaging also directly impacts dependability and quality.

Fonon’s FWLD technology can produce variable size dies on the same wafer as well as dicing complex shapes. Each die can be cut individually regardless of shape, size, or position. The process can involve using a backing tape frame for stability, along with dry processing, which eliminates water use and extra handling steps. The BlackStar can dice a variety of semiconductor materials, including some compound materials.

BlackStar systems are user- and regulation-friendly while guaranteeing operational excellence. For these reasons, Fonon’s FWLD technology continues to gain momentum in this and other industries working with brittle materials. Fonon’s BlackStar is manufactured and sold by Laser Photonics.

About Fonon Corporation

Fonon Corporation is a diversified industrial laser equipment company with a continuously growing umbrella of building-block technologies supported by patents, licenses, next-generation hardware, and proprietary metal processing IP. The company is dedicated to advancing industrial technology and designing specialized 3D metal printing systems for manufacturing purposes, representing the fastest path to Manufacturing Readiness Level 10.

Contacts

Recent Quotes

View More
Symbol Price Change (%)
AMZN  199.70
+0.10 (0.05%)
AAPL  258.23
-3.50 (-1.34%)
AMD  207.54
+1.60 (0.78%)
BAC  52.41
-0.12 (-0.22%)
GOOG  307.88
-1.49 (-0.48%)
META  645.80
-4.01 (-0.62%)
MSFT  403.35
+1.51 (0.38%)
NVDA  183.91
-3.03 (-1.62%)
ORCL  160.86
+4.38 (2.80%)
TSLA  421.27
+4.20 (1.01%)
Stock Quote API & Stock News API supplied by www.cloudquote.io
Quotes delayed at least 20 minutes.
By accessing this page, you agree to the Privacy Policy and Terms Of Service.
 
 
Photos copyright by Jay Graham Photographer
Copyright © 2010-2020 Sausalito.com & California Media Partners, LLC. All rights reserved.