FREMONT, Calif., Dec. 01, 2022 (GLOBE NEWSWIRE) -- ACM Research, Inc. (Nasdaq: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that it will be joining 13 other companies in collectively hosting the 11^th Annual NYC Summit investor conference, being held Tuesday, December 13^th at Mastro’s New York.

The presentation material utilized by ACM Research during the NYC Summit will be made accessible on the events page of the Company’s website at www.acmrcsh.com.

About the 11^th Annual NYC Summit
The NYC Summit is collectively hosted and funded by participating companies and features a “round-robin” format consisting of small group meetings with company management teams. During the event, investors and analysts will have the opportunity to meet with the majority of the 14 management teams during the small group meeting sessions, as well as opportunities to meet with management during the breakfast and lunch networking sessions.

The 14 management teams collectively hosting the 11^th Annual NYC Summit 2022 include: ACM Research (ACMR), Advanced Energy (AEIS), Aehr Test (AEHR), Alpha & Omega Semiconductor (AOSL), Axcelis (ACLS), FormFactor (FORM), Ichor Systems (ICHR), inTEST (INTT), Intevac (IVAC), Kopin Corporation (KOPN), Kulicke & Soffa (KLIC), Movella (PFDR), Onto Innovation (ONTO), and SkyWater Technology (SKYT). Both Cowen and Stifel are sponsors of the conference.

Attendance at the NYC Summit is by invitation only and is available solely to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. The last day for registration is December 1, 2022.

RSVP Contacts for 11th Annual NYC Summit 2022
To RSVP for the NYC Summit, please contact either of the Summit’s co-chairs:

About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing and vertical furnace processes, which are critical to advanced semiconductor device manufacturing and wafer-level packaging. The company is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmrcsh.com.

© ACM Research, Inc. Smart Megasonix and the ACM Research logo are trademarks of ACM Research, Inc. For convenience, this trademark appears in this press release without a ™ symbol, but that practice does not mean ACM will not assert, to the fullest extent under applicable law, its rights to such trademark.

For investor and media inquiries, please contact:

In the United States:        

The Blueshirt Group
Yujia Zhai
+1 (860) 214-0809
yujia@blueshirtgroup.com

In China:        

The Blueshirt Group Asia        
Gary Dvorchak, CFA        
+86 (138) 1079-1480
gary@blueshirtgroup.com