FREMONT, Calif., June 22, 2023 (GLOBE NEWSWIRE) -- ACM Research, Inc. (Nasdaq: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced management's participation in the 15th Annual CEO Investor Summit 2023, being held Wednesday, July 12th at the St. Regis Hotel, San Francisco, California.

The presentation material utilized by ACM Research during the CEO Investor Summit will be made accessible on the events page of the Company’s website at www.acmrcsh.com.

About the 15th Annual CEO Investor Summit 2023
The CEO Investor Summit is collectively hosted and funded by participating companies and features a “round-robin” format consisting of small group meetings with company management teams. During the event, investors and analysts will have the opportunity to meet with the majority of the 13 management teams during the small group meeting sessions, as well as opportunities to meet with management during the breakfast and lunch networking sessions.

The 13 management teams collectively hosting the 15th Annual CEO Investor Summit 2023 include: ACM Research (ACMR), Aehr Test (AEHR), Alpha & Omega Semiconductor (AOSL), Amtech Systems (ASYS), Axcelis (ACLS), Cohu, Inc. (COHU), Everspin Technologies (MRAM), FormFactor (FORM), Ichor Systems (ICHR), Kulicke & Soffa (KLIC), Magnachip Semiconductor (MX), nLIGHT, Inc. (LASR), and SkyWater Technology (SKYT). Jefferies, Stifel and TD Cowen are sponsors of the conference.

Attendance at the CEO Investor Summit is by invitation only and is available solely to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. Last day for registration is June 30, 2023.

RSVP Contacts for 15th Annual CEO Investor Summit 2023
To RSVP for the CEO Investor Summit, please contact either of the event co-chairs.

About ACM Research, Inc.
ACM develops, manufactures, and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing and thermal processes, which are critical to advanced semiconductor device manufacturing and wafer-level packaging. ACM is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmrcsh.com.

© ACM Research, Inc. The ACM Research logo is a trademark of ACM Research, Inc. For convenience, this trademark appears in this press release without a ™ symbol, but that practice does not mean that ACM will not assert, to the fullest extent under applicable law, its rights to such trademark.

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