Trends and Forecast for the Global Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) MarketTrends, opportunities and forecast in HMC and HBM market to 2027 by memory type (hybrid memory cube and high bandwidth memory), application (graphics, high performance computing, networking, and data centers and others), device type (CPU, GPU, FPGA, APU, and ASIC and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)Lucintel's latest market report analyzed that hybrid memory cube (HMC) and high-bandwidth memory (HBM) provides attractive opportunities in graphics, high performance computing, networking, and data center applications. The hybrid memory cube (HMC) and high-bandwidth memory (HBM) market is expected to reach $6.2 billion by 2027 with a CAGR of 28%. In this market, HBM (High Bandwidth Memory) is the largest segment by memory type, whereas high performance computing is largest by application. The development of advanced technology with new packaging options and increasing demand for HBM for enhancing virtual reality and augmented reality experience provides strategic growth path in this market.
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Based on protocol type, the Hybrid memory cube (HMC) and high-bandwidth memory (HBM) market is segmented into Ethernet, Infiniband, HDMI, PCI express (PCIE), thunderbolt, and others. The Ethernet segment is accounted for the largest share of the market in 2021 and it is also expected to witness the highest growth due to the increasing usage of Hybrid memory cube (HMC) and high-bandwidth memory (HBM)s for high performance computing and growth in inter and intra rack connectivity within a data center.
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The hybrid memory cube (HMC) and high-bandwidth memory (HBM) market is marked by the presence of several big and small players. Some of the prominent players offering Hybrid memory cube (HMC) and high-bandwidth memory (HBM) include Micron Technology (United States), Samsung Electronics (South Korea), and SK Hynix (South Korea).
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