Lucintel's latest market report analyzed that advanced IC packaging provides attractive opportunities in the consumer & communication, automotive, industrial, healthcare, and aerospace & defense industries. The advanced IC packaging market is expected to reach $52.3 billion by 2027 with a CAGR of 5.7%. In this market, flip-chip is the largest segment by packaging type, whereas consumer and communication is largest by end use industry. Development of packaging solutions for AI and IoT and introduction of new IC packaging technologies, such as fan out and 2.5D/3D provides strategic growth path in this market.
Download Brochure of this report by clicking on https://www.lucintel.com/advanced-packaging-market.aspx Based on packaging type, the advanced IC packaging market is segmented into flip-chip, fan-in wafer level packaging, embedded-die, fan-out, 2.5D/3D. The flip-chip segment accounted for the largest share of the market in 2021 and is expected to register the highest CAGR during the forecast period, due to rise in demand for high speed portable devices and high packaging density.
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68 – Tables
107 – Figures
205 – Pages
The Advanced IC packaging Market is marked by the presence of several big and small players. Some of the prominent players offering advanced IC packaging include Amkor Technology, Taiwan Semiconductor, Advanced Semiconductor Engineering Technology, Intel Corporation, Samsung Electronics, JCET Group, Texas Instruments, Toshiba Corporation, and Renesas.
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